Company Performance Metrics
The next generation 5G network will form the backbone of the fourth industrial revolution. We believe that by 2030 the planet will be blanketed by E-band connectivity. Existing E-band front-ends are bulky (~size of shoe-box), expensive (~$11k) and power hungry – and are not suited for small cell and massive MIMO.
Multifractal is addressing this
problem by developing fully integrated E-band front-ends on a single chip, in silicon (CMOS / BiCMOS). Our front-end chips will make E-band front-ends so small (size of a match-box), and so cheap (~$20), that they will cover every lamp-post and every street corner!
Multifractal's enabling technology is the ability to create high-Q E-band filters (and diplexers) on-chip in silicon and integrate them directly (still on chip) with the LNA, PA, switches and mixers, all in cheap mass producible silicon. Our customers can then feed the output of our IC directly into the digital back-end, reducing their front-end design, size, cost and effort. They do not have to worry about the RF – we do all that for them! This will enable miniaturization of the entire E-band front-end, for the first time allowing small cell and massive MIMO.
