85
70
Growth Score
-5 pts
Heat Score
-2 pts
Company Performance Metrics
Score
Trend
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Growth Score - The measure of growth based on company activity, operational metrics, and investments
Growth Trend - The change in the growth score over the given time period
Heat Score - The measure of the market interest, media activity, and Crunchbase profile activity
Heat Trend - The change in the heat score over the given time period
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Boschman Technologies is specializes in the development and supply of advanced transfer molding and sintering systems for electronic.
- Frank Boschman: Founder,CEO and managing Director
About the Company
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages. Our focus is on the following market segments:
Smartcards and discrete packages MEMS
and sensor packages Leadless and substrate-based packages Special application packages We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.
