the circuit board (PCB) industry opportunity, before addressing others.

Currently, the PCB industry predominantly employs a ""subtractive"" manufacturing method, which is highly labor and process intensive, produces poor yields at finer geometries and is limited in shape (flat only) and number of compatible substrates. Accordingly, advanced micro-electronics designs are increasingly cost-prohibitive and ""no-bid"" projects are becoming more and more common. The subtractive method is very caustic to the environment and the waste by product is expensive to mitigate. Furthermore, an antiquated process makes for a heavily commoditized market with extremely low margins.

Enter eSurface, a fully additive process. Manufacturing is simpler and more efficient, with far fewer processing steps. Yields are higher, even in multiples, for much finer and far more complex PCB designs. Labor usage and space requirements are reduced by multiples. Finally, as a result of these improvements, production costs are projected to descend by 50% or more.

Additionally, eSurface enables enhanced signal integrity, due to far tighter tolerances, expanded material selections, allowing plating of circuits on practically any material and shape, including 3D surfaces.

Also, there is vast improvement in adhesion of metal to substrate and, lastly, important environmental benefits via a closed loop process, radically reducing toxic waste. All of these improvements make for significant advances in microelectronics.

The eSurface business model is to license its technology to manufacturers for a royalty fee.