defects inside the most advanced chips.

QD's technology uses nitrogen-vacancy (NV) centers, atomic-scale defects in a diamond lattice that act as quantum sensors for magnetic fields. By measuring the magnetic fields generated by current flow, the system reconstructs current pathways inside multi-layer 2.5D and 3D chip architectures and localizes defects with micrometer precision and precise depth resolution. Crucially, the system operates non-destructively and at ambient conditions (no vacuum, no cryogenics), avoiding the slow, destructive layer-by-layer delayering that conventional failure analysis requires.

The flagship product, the QDm.1 (Quantum Diamond Microscope), is the world's first integrated quantum sensing tool commercially available for chip testing. It enables open and short detection in advanced semiconductors and advanced packaging at high speed, localizing opens (currently the leading yield-killing electrical failure) as intuitive spots on an image to accelerate root-cause analysis.

QD's customers are semiconductor foundries and fabs, IDMs, OSATs, and failure analysis labs. Nine of the world's ten largest chipmakers are engaged with the company, with systems deployed across Europe, the United States, and Asia. QD's product roadmap progresses from InLab defect localization (in production today) to InFab defect metrology (est. 2027) and InLine wafer mapping (est. 2028+), targeting 100% in-line quality control. The company has raised over $100M to date, is backed by World Fund, IQ Capital, Earlybird, Bayern Kapital, and others, and is investing €152M to build the world's first production facility for quantum-based semiconductor inspection in Munich, supported under the European Chips Act. QD employs 50+ people across 18 nationalities, with 30% PhDs and 17 patents.

Keywords: Semiconductor Inspection, Failure Analysis, Quantum Sensing, Magnetic Field Imaging, Nitrogen-Vacancy Centers, Advanced Packaging, Non-Destructive Testing, Defect Metrology, Yield Improvement, Chip Manufacturing.