applications across many markets, including electronics, defense, aerospace, and general industrial markets.

Since 2002, S-Bond Technologies has been providing patented active solders and bonding solutions utilizing their unique joining methods and their specially formulated active solders. Their S-Bond solders facilitate flux free, low temperature joining of materials such as dissimilar metals, intermetallics, ceramics, glasses, carbides and composites. In addition to their S-Bond active solders, S-Bond Technologies provides development, prototype and production bonding services along with Helium leak testing and ultrasonic C-Scan scanning services.