into a highly integrated low cost device with fast time to market. Their Unify - ASIC bridges the last 10% of the customer’s design into a low risk design since most of the complex and high performance connectivity functions are already completed in the standard products being used.

The Tekmos Unify - ASIC program for IoT uses their silicon interconnect with the bonus of adding unique IP, customer logic, and custom analog all in one device. They can integrate flash memory and mix technologies to also make the end product secure from copycats. This protects the customers market share and selling prices in the competitive world.

The Unify - ASIC is very attractive for startups or VC backed companies who wish to bring their products to market quickly and do not want to spend millions of dollars raised hiring expensive chip experts and tools. Tekmos handles the development process by working closely with the customer on their product definition and creating the device. They can evolve the product from inception and low volume for demonstrations or field trials and once approved to rapidly make devices in the millions as required without the customer having to make huge commitments to quantities until they are ready.

Tekmos has since 1997 been a reliable source of ASIC devices for hundreds of companies interested in replacing legacy microprocessors, ASICs, and FPGAs via conversions. Every product is designed here in the USA and after wafers are processed and die assembled, will be tested and shipped from Austin, Texas to any location worldwide. Tekmos is ISO 9001 certified and has supplied devices for critical medical and defense projects for many years.