PCB design and manufacturing, and package engineering. In the embedded systems domain, the company provides end-to-end offerings spanning system-on-module development, embedded hardware and software, turnkey product development, firmware, and IoT solutions featuring connectivity modules, gateways, and cloud/backend support. Innovation is fostered through its Center of Excellence, which focuses on areas such as VLSI, test engineering, embedded systems, and PCB, enhancing technology adoption and engineering solutions. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others.

Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities.

Tessolve’s clientele includes Tier 1 clients across multiple market segments, 9 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, Canada, UK, Japan, Taiwan, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.